| Entry name | 3D 測量和表面重構的系統與方法 |
| Project No | I000334 |
| Price per share | HK $0.00 |
| Number | 1 |
| Transaction time | 2014-12-07 00:00:00 ~ 2022-12-31 00:00:00 |
Notice: Please review the details of the project before you make a purchase. Click here to read the HKIPX IP Auction Agreement
| Entry name:3D 測量和表面重構的系統與方法 | |
| Format | Brokered IP Deals |
| Industry | Electronics & Electrical Appliances |
| IP Holder | -- |
| IP Originator | -- |
| Entry name | 3D 測量和表面重構的系統與方法 |
| Registration ID | 美國專利號:12/269124 |
| Region | 44 |
| Application Date | 2022-06-06 00:00:00 |
| Grant Date | 2022-12-31 00:00:00 |
| Project Location | ChinaHong Kong |
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